Hysol PL 777-1FR Epoxy Film Adhesive
MANUFACTURER
DESCRIPTION
Hysol® PL 777-1FR is a flame retardant, non-metallic, modified epoxy film adhesive that is designed to cure at either 250°F (121°C) or 350°F (180°C) with a service temperature in excess of 300°F (149°C).
APPLICATION
Hysol PL 777-1FR is suitable for metal bond applications; however,it is suitable with many thermoplastic substrates.
PROPERTIES
Controlled flow and dual cure at 250°F (120°C) in 90 minutes or at 350°F (180°C) in 1 hour with service temperatures in excess of 270°F (132°C), excellent peel strength, superior hot/wet properties.