Hysol PL 685 Core Splice


MANUFACTURER

Henkel-Hysol


DESCRIPTION

Plastilock® 685 (PL 685) is an expanding film adhesive


APPLICATION

Plastilock® 685 (PL 685) is designed for applications which require controlled expansion and environmental durability. PL 685 cures at either 250°F (121°C) or 350°F (177°C) and features a 30 day maximum out-time at 75°F (24°C).


PROPERTIES

Uniform controlled expansion, closed cell, moderate tack, sag resistant